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Electrically Conductive Adhesive Pastes
| Product Number |
Manufacturer | TDS | MIL-STD Cert | Features | Syringe Size | Work Life | Storage Life | Cure |
|---|---|---|---|---|---|---|---|---|
| 84-1LMI | Henkel/Ablestik | Data Sheet | Yes | die attach, auto & hand dispense, screen print | 3 cc | 2 weeks | 1 yr., -40c | 60 min @ 150ËšC |
| 84-1LMISR4 | Henkel/Ablestik | Data Sheet | No | die attach, high throughput auto dispensing | 3 cc | 18 hours | 1 yr., -40c | 60 min @ 175ËšC |
| 84-1LMIT | Henkel/Ablestik | Data Sheet | Yes | die attach, higher thermal conductivity | 3 cc | 2 weeks | 1 yr., -40c | 60 min @ 150ËšC |
| 84-1LMIT1 | Henkel/Ablestik | Data Sheet | Yes | die attach, higher thermal, lower viscosity | 1 cc | 2 weeks | 1 yr., -40c | 60 min @ 150ËšC |
| 84-1LMINB | Henkel/Ablestik | Data Sheet | Yes | die attach, high purity, no-bleed | 1 cc | 3 days | 1 yr., -40c | 30 min @ 150ËšC |
| XCE - 3104 XL | Henkel/Emerson Cuming | Data Sheet | No | component attach, solder replacement, lead free | 3 cc | 18 hours | 6 mo., -40c | 10 min @ 150ËšC |
| H9890-6A | NAMICS | Data Sheet | No | Highest Thermal Conductivity, Auto Dispense, silver sintered | 5 cc | 48 hours | 12 mo., -40c | Ramp Cure-See Data Sheet |
| H9890-6 | NAMICS | Data Sheet | No | High Thermal Conductivity, Large Die Application | 5 cc | 48 hours | 12 mo., -40c | Ramp Cure-See Data Sheet |
| 8175 | Henkel/Ablestik | Data Sheet | Yes | die attach, stress absorbing, fine pitch printing | 3 cc | 2 weeks | 1 yr., -40c | 30 min @ 130ËšC |
| JM 7000 | Henkel/Ablestik | Data Sheet | No | High throughput die attach, low moisture, low weight loss | 3 cc | 8-16 hours | 1 yr., -40c | 30 min @ 150ËšC |
| H20E | Epoxy Technology | Data Sheet | No | die attach, good thermal, 1 part frozen | 3cc | 1 yr., -40c | 10 min @ 150ËšC | |
| H20E | Epoxy Technology | Data Sheet | No | die attach, good thermal, economical, 2 part | 1 oz kit | 2.5 days | 1 yr., 25c | 10 min @ 150ËšC |
Electrically Insulating Adhesive Pastes
| Product Number | Manufacturer | TDS | MIL-STD Cert | Features | Syringe Size |
Work Life | Storage Life | Cure |
|---|---|---|---|---|---|---|---|---|
| 84-3 | Henkel/Ablestik | Data Sheet | Yes | die attach, one component | 1 cc | 2 week | 1 yr., -40c | 60 min @ 150ËšC |
| 958-11 | Henkel/Ablestik | Data Sheet | Yes | die attach, stress absorbing, one component | 1 cc | 2 week | 1 yr., -40c | 60 min @ 150ËšC |
| 789-3 | Henkel/Ablestik | Data Sheet | No | High Adhesion, Moisture Resistant | 3 cc | 3 months | 1 yr., -40c | 30 min @ 150ËšC, 4 hrs @ 93c |
| H70E | Epoxy Technology | Data Sheet | No | die attach and staking, economical | 1 lb kit | 2 days | 1 yr., 25c | 30 min @ 150ËšC |
Electrically Conductive Adhesive Films
| Product Number | Manufacturer | TDS | MIL-STD Cert | Features | Film Thick-ness (Mils) | Work Life | Storage Life | Cure |
|---|---|---|---|---|---|---|---|---|
| 5025E | Henkel/ Ablestik |
Data Sheet | Yes | 10" x 12" sheet, high electrical & thermal performance | 2, 3, 4, 5, 6 | 3 months | 6 mos., 5c | 30 min @ 150ËšC |
| CF - 3350 | Henkel/ Emerson & Cuming |
Data Sheet | No | 10" x 12" sheet, high electrical & thermal performance | 2, 4 | 3 months | 9 mo. @ 5c | 30 min @ 150ËšC |
| ECF561E | Henkel/ Ablestik |
Data Sheet | No | 12" x 12" sheet, for CTE mismatch | 4, 5, 6 | 4 days | 1 yr., -40c | 30 min @ 150ËšC |
Electrically Insulating Adhesive Films
| Product Number | Manufacturer | TDS | MIL-STD Cert | Features | Film Thick-ness (Mils) |
Work Life | Storage Life | Cure |
|---|---|---|---|---|---|---|---|---|
| 5020K | Henkel/ Ablestik |
Data Sheet | Yes | 10" x 12" sheet, good thermal, MIL-SPEC, glass fabric | 4, 5 | 6 months | 1 yr, -40C | 60 min @ 150ËšC |
| 550K | Henkel/ Ablestik |
Data Sheet | No | 12" x 12" good thermal, glass fabric, substrate attach | 5 | 6 months | 1 year, -40c | 30 min @ 150ËšC |
| 561K | Henkel/ Ablestik |
Data Sheet | No | 10" x 12" CTE Mismatch, Reworkable | 4, 5, 6 | 6 months | 1 year, -40c | 30 min @ 150ËšC |
| 563K | Henkel/ Ablestik |
Data Sheet | No | 10" x 12" Low Squeeze out | 2, 3 | 3 months | 1 year, -40c | 30 min @ 150ËšC |
| 570K | Henkel/ Ablestik |
Data Sheet | yes | 8" x 12" High Purity hybrid substrate attach | 4, 5, 6 | 12 days | 1 year, -40c | 3 hours @ 150ËšC |
Encapsulants and Glob-tops
| Product Number | Manufacturer | TDS | MIL-STD Cert | Features | Syringe Size | Work Life | Storage Life | Cure |
|---|---|---|---|---|---|---|---|---|
| FP 4323 | Henkel/Hysol | Data Sheet | No | low flow, high purity glob top | 10 cc | 2 days | 9 months-40c | 3 options, see TDS |
| FP4451 | Henkel/Hysol | Data Sheet | No | high purity damming material | 10 cc | 2 days | 9 months-40c | 1 hour @ 165ËšC |
| FP4650 | Henkel/Hysol | Data Sheet | No | high purity liquid epoxy encapsulant | 30 cc | 8 days | 9 months-40c | 3 hours @ 170ËšC |
Solder Sheet Stock for Pre-forms
| Product Number | Manufacturer | MIL-STD Cert | Features | Film Thick -ness (Mils) |
Work Life | Storage Life | Cure |
|---|---|---|---|---|---|---|---|
| SN63 | Indium Corporation | No | Best Thermal and Elec. Conductivity | 1, 2, 3 | No Limit | Room Temp | Reflow ~183c |
| SN96 | Indium Corporation | No | Best Thermal and Elec. Conductivity | 1, 2 | No Limit | Room Temp | Reflow ~221c |