Non-Conductive Adhesive Die Attach Epoxy
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| Product Number | Manufacturer | Data Sheets | MIL-STD Cert | Features | Tg | Viscosity cPs | Thermal Conductivity | CTE below/above Tg | Syringe Size |
Work Life | Storage Life | Cure |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 84-3 | Henkel/Ablestik | TDS SDS |
Yes | die attach, one component | 85c | 50,000 | .8 W/mK | 41/100 | 1 cc | 2 week | 1 yr., -40c | 60 min @ 150˚C |
| 958-11 | Henkel/Ablestik | TDS SDS |
Yes | die attach, stress absorbing, one component | 89c | 40,000-50,000 | 15/45 | 1 cc | 2 week | 1 yr., -40c | 60 min @ 150˚C | |
| 789-3 | Henkel/Ablestik | TDS SDS |
No | High Adhesion, Moisture Resistant | 126c | 36,500 | .3 W/mK | 63/140 | 3 cc | 3 months | 1 yr., -40c | 30 min @ 150˚C, 4 hrs @ 93c |
| H70E | Epoxy Technology | TDS SDS |
No | die attach and staking, economical | 80c | 4,000-7,000 | .9 W/mK | 15/64 | 1 lb kit | 2 days | 1 yr., 25c | 30 min @ 150˚C |