ABLEBOND 84-1LMISR4 electrically conductive die attach adhesive paste has been formulated for use in high throughput, automated die attach equipment. The rheology of ABLEBOND 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one of the most widely used die attach materials in the semiconductor industry.  84-1LMISR4 comes in 3cc pre-mixed and frozen syringes, ships on dry ice and is stored at -40c.  Ships today if ordered by 2:00 pm EST.