Electrically Conductive Adhesive Epoxy Pastes
In Stock, No Minimum Charges Click on links in red for product pages and Data Sheets
Product Number |
Manufacturer | Data Sheets | MIL-STD Cert | Features | Tg | Viscosity cPs | Thermal Conductivity | CTE below/above Tg | Resistivity Ohm-cm | Syringe Size | Work Life | Storage Life | Cure |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
84-1LMI | Henkel/Ablestik | TDS SDS |
Yes | die attach, auto & hand dispense, screen print | 103c | 30,000 | 2.4 W/mK | 55/150 | .0005 | 3 cc | 2 weeks | 1 yr., -40c | 60 min @ 150˚C |
84-1LMISR4 | Henkel/Ablestik | TDS SDS |
No | die attach, high throughput auto dispensing | 120c | 8,000 | 2.5 W/mK | 40/150 | .0002 | 3 cc | 18 hours | 1 yr., -40c | 60 min @ 175˚C |
84-1LMIT | Henkel/Ablestik | TDS SDS |
Yes | die attach, higher thermal conductivity | 103c | 50,000 | 4.3 W/mK | 52/20 | .00007 | 3 cc | 2 weeks | 1 yr., -40c | 60 min @ 150˚C |
84-1LMIT1 | Henkel/Ablestik | TDS SDS |
Yes | die attach, higher thermal, lower viscosity | 103c | 22,000 | 3.6 W/mK | 20/200 | .0005 | 1 cc | 2 weeks | 1 yr., -40c | 60 min @ 150˚C |
84-1LMINB | Henkel/Ablestik | TDS SDS |
Yes | die attach, high purity, no-bleed | 117c | 60,000 | 4.5 W/mk | 52/150 | .00009 | 1 cc | 3 days | 1 yr., -40c | 30 min @ 150˚C |
XCE - 3104 XL | Henkel/Emerson Cuming | TDS SDS |
No | component attach, solder replacement, lead free | 109c | 54,000 | 1.8 W/mk | 46/160 | .0005 | 3 cc | 18 hours | 6 mo., -40c | 10 min @ 150˚C |
H9890-6A | NAMICS | TDS SDS |
No | Highest Thermal Conductivity, Auto Dispense, silver sintered | 120-140 W/mK | /23 | .000008 | 5 cc | 48 hours | 12 mo., -40c | Ramp Cure-See Data Sheet | ||
H9890-6 | NAMICS | TDS SDS |
No | High Thermal Conductivity, Large Die Application | 30-60 W/mK | /45 | .000015 | 5 cc | 48 hours | 12 mo., -40c | Ramp Cure-See Data Sheet | ||
8175 | Henkel/Ablestik | TDS SDS |
Yes | die attach, stress absorbing, fine pitch printing | 90c | 55,000 | 3.2 W/mK | 55/200 | .0005 | 3 cc | 2 weeks | 1 yr., -40c | 30 min @ 130˚C |
JM 7000 | Henkel/Ablestik | TDS SDS |
No | High throughput die attach, low moisture, low weight loss | 240c | 9,000 | 1.0 W/mK | 33/ | .01 | 3 cc | 8-16 hours | 1 yr., -40c | 30 min @ 150˚C |
H20E | Epoxy Technology | TDS SDS |
No | die attach, good thermal, 1 part frozen | 80c | 2,200-3,200 | 2.5 - 29 W/mK | 31/158 | .0004 | 3cc | 2.5 days | 1 yr., -40c | 10 min @ 150˚C |
H20E | Epoxy Technology | TDS SDS |
No | die attach, good thermal, economical, 2 part | 80c | 2,200-3,200 | 2.5 - 29 W/mK | 31/158 | .0004 | 1 oz kit | 2.5 days | 1 yr., 25c | 10 min @ 150˚C |
DM6030HK | NAMICS | TDS SDS |
No | die attach, high thermal | 92c | 31,000 | 60 W/mK | 26/ | .0008 | 5 cc | 24 hrs. | 1 yr., -40c | Ramp Cure, see data sheet |