Epoxy Quick Fact Sheet

Electrically Conductive Adhesive Pastes

Product Number Manufacturer Certified to MIL-STD 883, Method 5011 Features Syringe Size Work Life @ Room Temp Storage Life Recommended Cure Schedule
84-1LMI Ablestik Yes die attach, auto & hand dispense, screen print 3 cc 2 weeks 1 yr., -40c 60 min @ 150˚C
84-1LMI Ablestik Yes die attach, auto & hand dispense, screen print 3 cc 2 weeks 1 yr., -40c 60 min @ 150˚C
84-1LMISR4 Ablestik Yes die attach, high throughput auto dispensing 3 cc 18 hours 1 yr., -40c 60 min @ 175˚C
84-1LMIT1 Ablestik Yes die attach, higher thermal, lower viscosity 1 cc 2 weeks 1 yr., -40c 60 min @ 150˚C
84-1LMINB Ablestik Yes die attach, high purity, no-bleed 1 cc 3 days 1 yr., -40c 30 min @ 150˚C
XCE – 3104 XL Emerson & Cuming No component attach, solder replacement, lead free 3 cc 18 hours 6 mo., -40c 10 min @ 150˚C
8175 Ablestik Yes die attach, stress absorbing, fine pitch printing 3 cc 2 weeks 1 yr., -40c 30 min @ 130˚C
Tra-duct 2902 Henkel No Two component, room temp cure, versatile Pre-measured 2.65 Gram BIPAX 60 min. 6 months, room temp 24hrs @ Room Temp, 15min @ 150c
H2OE Epoxy Technology No die attach, good thermal, 1 part frozen 1cc in 3cc 1 yr., -40c 10 min @ 150˚C
H2OE Epoxy Technology No die attach, good thermal, economical, 2 part 1 oz kit 2.5 days 1 yr., 25c 10 min @ 150˚C

Electrically Insulating Adhesive Pastes

Product Number Manufacturer Certified to MIL-STD 883, Method 5011 Features Syringe Size Work Life @ Room Temp Storage Life Recommended Cure Schedule
84-3 Ablestik Yes die attach, one component 1 cc 2 week 1 yr., -40c 60 min @ 150˚C
958-11 Ablestik Yes die attach, stress absorbing, one component 1 cc 2 week 1 yr., -40c 60 min @ 150˚C
H70E Epoxy Technology No die attach and staking, economical 1 lb kit 2 days 1 yr., 25c 30 min @ 150˚C

Electrically  Conductive Adhesive Films

Product Number Manufacturer Certified to MIL-STD 883, Method 5011 Features Film Thickness (Mils) Work Life @ Room Temp Storage Life Recommended Cure Schedule
5025E Ablestik Yes 10″ x 12″ sheet, high electrical & thermal performance 2,3,4 3 months 1 yr, -40C 30 min @ 150˚C
CF – 3350 Emerson & Cuming No 10″ x 12″ sheet, high electrical & thermal performance 2,4 3 months 9 mo. @ 5c 30 min @ 150˚C
ECF561E Ablestik No 12″ x 12″ sheet, for CTE mismatch 5 4 days 1 yr., -40c 30 min @ 150˚C

Electrically Insulating Adhesive Films


Product Number Manufacturer Certified to MIL-STD 883, Method 5011 Features Film Thickness (Mils) Work Life @ Room Temp Storage Life Recommended Cure Schedule
5020K Ablestik Yes 10″ x 12″ sheet, good thermal, MIL-SPEC, glass fabric 5 6 months 1 yr, -40C 60 min @ 150˚C
550K Ablestik No 12″ x 12″ good thermal, glass fabric,substrate attach 5 6 months 1 year, -40c 30 min @ 150˚C

Solder Sheet Stock for Pre-forms


Product Number Manufacturer Certified to MIL-STD 883, Method 5011 Features Film Thickness (Mils) Work Life @ Room Temp Storage Life Recommended Cure Schedule
SN63 Indium Corporation No Best Thermal and Elec. Conductivity .001″, .002″ No Limit Room Temp Reflow ~183c
SN96 Indium Corporation No Best Thermal and Elec. Conductivity .001″, .002″ No Limit Room Temp Reflow ~221c

Encapsulants and Glob-tops

Product Number Manufacturer Certified to MIL-STD 883, Method 5011 Features Syringe Size Work Life @ Room Temp Storage Life Recommended Cure Schedule
FP4401 Loctite/Hysol No low flow, high purity glob top 10 cc 24 hours 1 yr., -40c 6 hours @ 150˚C
FP4451 Loctite/Hysol No high purity damming material 10 cc 2 days 1 yr., -40c 1 hour @ 165˚C
FP4650 Loctite/Hysol No high purity liquid epoxy encapsulant 30 cc 8 days 1 yr., -40c 3 hours @ 170˚C