• In Stock
  • No Minimum Charge

Electrically Conductive Adhesive Pastes

Product Number
Manufacturer TDS MIL-STD Cert Features Syringe Size Work Life Storage Life  Cure
84-1LMI Henkel/Ablestik Data Sheet Yes die attach, auto & hand dispense, screen print 3 cc 2 weeks 1 yr., -40c 60 min @ 150˚C
84-1LMISR4 Henkel/Ablestik Data Sheet No die attach, high throughput auto dispensing 3 cc 18 hours 1 yr., -40c 60 min @ 175˚C
84-1LMIT Henkel/Ablestik Data Sheet Yes die attach, higher thermal conductivity 3 cc 2 weeks 1 yr., -40c 60 min @ 150˚C
84-1LMIT1 Henkel/Ablestik Data Sheet Yes die attach, higher thermal, lower viscosity 1 cc 2 weeks 1 yr., -40c 60 min @ 150˚C
84-1LMINB Henkel/Ablestik Data Sheet Yes die attach, high purity, no-bleed 1 cc 3 days 1 yr., -40c 30 min @ 150˚C
XCE - 3104 XL Henkel/Emerson Cuming Data Sheet No component attach, solder replacement, lead free 3 cc 18 hours 6 mo., -40c 10 min @ 150˚C
H9890-6A NAMICS Data Sheet No Highest Thermal Conductivity, Auto Dispense, silver sintered 5 cc 48 hours 12 mo., -40c Ramp Cure-See Data Sheet
H9890-6 NAMICS Data Sheet No High Thermal Conductivity, Large Die Application 5 cc 48 hours 12 mo., -40c Ramp Cure-See Data Sheet
8175 Henkel/Ablestik Data Sheet Yes die attach, stress absorbing, fine pitch printing 3 cc 2 weeks 1 yr., -40c 30 min @ 130˚C
JM 7000 Henkel/Ablestik Data Sheet No High throughput die attach, low moisture, low weight loss 3 cc 8-16 hours 1 yr., -40c 30 min @ 150˚C
H20E Epoxy Technology Data Sheet No die attach, good thermal, 1 part frozen 3cc 1 yr., -40c 10 min @ 150˚C
H20E Epoxy Technology Data Sheet No die attach, good thermal, economical, 2 part 1 oz kit 2.5 days 1 yr., 25c 10 min @ 150˚C

 

Electrically Insulating Adhesive Pastes

Product Number Manufacturer TDS MIL-STD Cert Features Syringe
Size
Work Life Storage Life Cure
84-3 Henkel/Ablestik Data Sheet Yes die attach, one component 1 cc 2 week 1 yr., -40c 60 min @ 150˚C
958-11 Henkel/Ablestik Data Sheet Yes die attach, stress absorbing, one component 1 cc 2 week 1 yr., -40c 60 min @ 150˚C
789-3 Henkel/Ablestik Data Sheet No High Adhesion, Moisture Resistant 3 cc 3 months 1 yr., -40c 30 min @ 150˚C, 4 hrs @ 93c
H70E Epoxy Technology Data Sheet No die attach and staking, economical 1 lb kit 2 days 1 yr., 25c 30 min @ 150˚C

 

Electrically  Conductive Adhesive Films

Product Number Manufacturer TDS MIL-STD Cert Features Film Thick-ness (Mils) Work Life Storage Life  Cure
5025E Henkel/
Ablestik
Data Sheet Yes 10" x 12" sheet, high electrical & thermal performance 2,3,4 3 months 6 mos., 5c 30 min @ 150˚C
CF - 3350 Henkel/
Emerson & Cuming
Data Sheet No 10" x 12" sheet, high electrical & thermal performance 2,4 3 months 9 mo. @ 5c 30 min @ 150˚C
ECF561E Henkel/
Ablestik
Data Sheet No 12" x 12" sheet, for CTE mismatch 5 4 days 1 yr., -40c 30 min @ 150˚C

 

Electrically Insulating Adhesive Films

Product Number Manufacturer TDS MIL-STD Cert Features Film
Thick-ness (Mils)
Work Life Storage Life  Cure 
5020K Henkel/
Ablestik
Data Sheet Yes 10" x 12" sheet, good thermal, MIL-SPEC, glass fabric 5 6 months 1 yr, -40C 60 min @ 150˚C
550K Henkel/
Ablestik
Data Sheet No 12" x 12" good thermal, glass fabric, substrate attach 5 6 months 1 year, -40c 30 min @ 150˚C
561K Henkel/
Ablestik
Data Sheet No 10" x 12" CTE Mismatch, Reworkable 5 6 months 1 year, -40c 30 min @ 150˚C

 

Encapsulants and Glob-tops

Product Number Manufacturer TDS MIL-STD  Cert Features Syringe Size Work Life Storage Life  Cure 
FP 4323 Henkel/Hysol Data Sheet No low flow, high purity glob top 10 cc 2 days 9 months-40c 3 options, see TDS
FP4451 Henkel/Hysol Data Sheet No high purity damming material 10 cc 2 days 9 months-40c 1 hour @ 165˚C
FP4650 Henkel/Hysol Data Sheet No high purity liquid epoxy encapsulant 30 cc 8 days 9 months-40c 3 hours @ 170˚C

 

Solder Sheet Stock for Pre-forms

Product Number Manufacturer MIL-STD Cert Features Film Thick
-ness (Mils)
Work Life Storage Life  Cure 
SN63 Indium Corporation No Best Thermal and Elec. Conductivity 1, 2, 3 No Limit Room Temp Reflow ~183c
SN96 Indium Corporation No Best Thermal and Elec. Conductivity 1, 2 No Limit Room Temp Reflow ~221c