DIEMAT 6030HK/F954 (NAMICS DIEMAT 6030HK/F954)
In Stock, No Minimum Charges
DM6030Hk/F954 is a silver-loaded epoxy adhesive with high thermal and electrical conductivity. A unique, patented organic system enables high filler loading of Ag powder/flake combinations. DM6030HK can be used as a eutectic solder replacement and is lead free. Please read the datasheet as it recommends a special cure profile. Bonding Source stocks 6030HK in 5cc frozen syringes and ships on dry ice. Ships today if ordered by 2:00 pm EST
