Digitally Controlled Hot Plates

Bonding Source low profile hot plates are the microelectronics and RF/Microwave assembler's choice for pre-tacking epoxy film, epoxy curing, SMD reflow, rework, and wire bonding base heat.

  • The hot plate system is modular.
    • Hot plates, controllers and connecting power cords are sold separately.
    • The digital PID temperature controller can be used interchangeably with any hot plate.
  • Hot plates have a  low profile height of 1.4" and heat to 300c.
    • Sizes include 2.5" x 3.0", 4" x 6", and 6.5" x 10.5"
  • Digital temperature controller ensures process consistency.
  • Rapid heating and recovery.
  • One year warranty on hot plate and controller
  • Made in USA, Manchester NH
Description Spec Sheets Cost
BS-2.5" x 3.0" Hot Plate Spec Sheet $650.00
BS-4.0" x 6" Hot Plate Spec Sheet $760.00
BS-6.5" x 10.5" Hot Plate Spec Sheet $900.00
Digital PID Controller Spec Sheet $350.00
Thermo-couple Cable Assembly $150.00
Large hot plate for electronics and RF/Microwave assembly heats to 300c

6.5" x 10.5" Hot Plate with Digital Controller

Digital hot plate with controller for electronics and RF/Microwave assembly heats to 300c

2.5" x 3.0" Hot Plate and Digital Controller