Digitally Controlled Hot Plates
Bonding Source low profile hot plates are the microelectronics and RF/Microwave assembler's choice for pre-tacking epoxy film, epoxy curing, SMD reflow, rework, and wire bonding base heat.
- The hot plate system is modular.
- Hot plates, controllers and connecting power cords are sold separately.
- The digital PID temperature controller can be used interchangeably with any hot plate.
- Hot plates have a low profile height of 1.4" and heat to 300c.
- Sizes include 2.5" x 3.0", 4" x 6", and 6.5" x 10.5"
- Digital temperature controller ensures process consistency.
- Rapid heating and recovery.
- One year warranty on hot plate and controller
- Made in USA, Manchester NH
|BS-2.5" x 3.0" Hot Plate||Spec Sheet||$650.00|
|BS-4.0" x 6" Hot Plate||Spec Sheet||$760.00|
|BS-6.5" x 10.5" Hot Plate||Spec Sheet||$900.00|
|Digital PID Controller||Spec Sheet||$350.00|
|Thermo-couple Cable Assembly||$150.00|