Non-Conductive Adhesive Die Attach Epoxy

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Product Number Manufacturer TDS MIL-STD Cert Features Tg Viscosity cPs Thermal Conductivity CTE below/above Tg Syringe
Size
Work Life Storage Life Cure
84-3 Henkel/Ablestik Data Sheet Yes die attach, one component 85c 50,000 .8 W/mK 41/100 1 cc 2 week 1 yr., -40c 60 min @ 150˚C
958-11 Henkel/Ablestik Data Sheet Yes die attach, stress absorbing, one component 89c 40,000-50,000 15/45 1 cc 2 week 1 yr., -40c 60 min @ 150˚C
789-3 Henkel/Ablestik Data Sheet No High Adhesion, Moisture Resistant 126c 36,500 .3 W/mK 63/140 3 cc 3 months 1 yr., -40c 30 min @ 150˚C, 4 hrs @ 93c
H70E Epoxy Technology Data Sheet No die attach and staking, economical 80c 4,000-7,000 .9 W/mK 15/64 1 lb kit 2 days 1 yr., 25c 30 min @ 150˚C