Bonding Sources develops new Epoxy Film Press

The new EFP 500 offered by Bonding Source is an excellent tool for organizations needing precise control for their epoxy film attachment processes.  The press is extremely repeatable and has an integrated load cell to confirm applied pressure.  The press puts out over 500 lbs of force to handle large microwave module assemblies and various conductive films that may require more pressure.  The press provides a repeatable output to control the process, and is also easily adjustable for various size modules. Please contact us for process details.

Epoxy film press for substrate attach rf microwave circuits conductive