The NAMICs family of pastes has the highest thermal conductivity of any die attach epoxy paste we carry. This material has been developed to replace Diemat 6030 series epoxy and eutectic solder attachment processes. H9890-6 has a lower modulus and slightly lower thermal conductivity to the -6A product we carry, and is designed for larger die attach applications. The cure schedule is critical for performance. Please see the data sheet for details. H9890-6 comes in 5cc syringes and ships on dry ice. It should be stored at -40c. Ships today if ordered by 2:00 pm.