In Stock, No Minimum Charge
EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy paste designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also available in single component frozen syringes. H20E is used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is still the conductive adhesive of choice for new applications. H20E two part kits are stored at room temperature. H20E pre-mixed and frozen 3cc syringes ship on dry ice and should be stored at -40c. Two part kits and frozen syringes are in stock and ship today if ordered by 2:00 pm EST.
Technical Data Sheet (PDF)
Safety Data Sheet(PDF)
