ECF563 Film Epoxy
LOCTITE ABLESTIK ECF 563 unsupported epoxy adhesive film is
ideal for bonding "hot" devices onto heat sinks in applications where
electrical insulation is not required. This adhesive provides RF/EMI
shielding in bonding microwave substrates into packages. ECF563 comes in 10" x 12" sheets and thicknesses of .002" - .006". It ships on cold packs and should be stored at 5c. Bonding Source also offers custom cutting of preforms with this material. ECF563 is a non-stock item for Bonding Source, so additional lead times and minimum order quantities may apply.
Technical Data Sheet (PDF)
Safety Data Sheet (PDF)