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DM6030Hk/F954 is a silver-loaded epoxy adhesive with high thermal and electrical conductivity. A unique, patented organic system enables high filler loading of Ag powder/flake combinations.  DM6030HK can be used as a eutectic solder replacement and is lead free.  Please read the datasheet as it recommends a special cure profile.  Bonding Source stocks 6030HK in 5cc frozen syringes and ships on dry ice.  Ships today if ordered by 2:00 pm EST

Technical Data Sheet
Safety Data Sheet(PDF)
Diemat Namics 6030HK Conductive Die Attach Adhesive