In Stock, No Minimum Charge
EPO-TEK H70E is a 2 component thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronic applications. It has a flexible cure schedule, from 80c to 175c. H70E comes in a 1 pound, two part kit and is stored at room temperature. It is in stock and can ship today if ordered by 2:00 pm EST
Technical Data Sheet (PDF)
Safety Data Sheet (PDF)
