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- Back Side
The Ultimate Bonding Coupon has been developed to be the best “known good” thin film bonding coupon in the microelectronics and RF/Microwave industry. Uses for the Ultimate Bonding Coupon include:
- Wire Bond Pull Test Certification. Use for wire bond set up to ensure destruct and non-destruct wire pull strength for all types of wires and ribbon. You’ll get a destruct bond pull reading C of C with each lot of Coupons you buy from Bonding Source (typically 10-13 grams for .001” Au wire). If you don’t obtain similar results, you know there is a set-up problem.
- Training and machine set up. The Ultimate Bonding Coupon is the most effective and economical way to train employees and set up machines for automatic and manual wire bonding. Use the coupon to train employees on wire bond criteria, loop control, targeting, foot impression and “at rate” bonding capability. Don’t waste expensive die and substrates trying to train employees or setting up machines. The Ultimate Bonding Coupon includes .004” pads with .004” spacing. Ensure bonders can bond to these pads before they work on production units.
- Die Shear. Die shear epoxy attach, solder attach and direct eutectic attach of semiconductor devices.
- Epoxy evaluation. Use the Ultimate Bonding coupon to evaluate epoxy paste and film adhesives.
- Solder and Eutectic Die attach set up. The Bonding Coupon can be used to set up die attach parameters for solder reflow on hot gas die bonders.
- Board-mount with sheet and paste epoxies. Use the Coupon to verify parameters for mounting substrates onto carriers and housings.
- Specifications:
-Material: .025” thick, as fired, (<3u”), 99.6% Al2O3.
-Metallization: 300-500A WTi, under 2000A Pd, under 100-150u” Au, front and back sides.
-Dimensions: .40″ x .40″ x .025″. - What your order contains:
- Cost: $600.00 for a pack of 25.
-A pack of 25 Ultimate Bonding Coupons.
-Destruct wire bond pull test C of C readings for your lot, with actual bond pull readings to compare with your future tests.
