Other Laser Cut Material
Bonding Source offers laser cutting of other materials frequently used in conjunction with epoxy film preforms.
Materials include:
Microwave absorber- various options in stock
EMI Shielding
Thermal Interface Sheets
Teflon - .005", .010", .015" in stock
Silicon Press board- .062", .125" In stock
Flourosilicone- .062", .125" in stock
Pacothane/Pacopad- Pacothane 5500 .055" in stock