In Stock, No Minimum Charge

EPO-TEK H70E is a 2 component thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronic applications.  It has a flexible cure schedule, from 80c to 175c. H70E comes in a 1 pound, two part kit and is stored at room temperature.  It is in stock and can ship today if ordered by 3:00 pm EST

Technical Data Sheet (PDF)

H70E EPOTEK Epoxy Technology 2 part kit