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Pre-Forms

Bonding Source offers one week delivery of epoxy pre-forms available from our in-stock epoxy film selection.

  • Choose your epoxy film from the Bonding Source in-stock selection.
  • Send us your CAD data as a dwg or dxf file via email. If you don’t have CAD data on-hand for your pre-form, your substrate vendor should have a file for the substrate or board that you can forward to Bonding Source.
  • We will then review the layout with you to ensure complete coverage, minimize bleed-out and possible shorting, and the most efficient use of film stock.
  • The pallet file is then sent to the laser and the pre-form is cut. Your file will be kept with us to facilitate future orders. We can provide first article samples before proceeding with production quantities
  • Your pre-forms will be shipped to you on cold packs per the manufacturer's specifications to minimize cracking.
  • Bonding Source can package and label pre-forms per your specification, and can release shipments all at once or spaced out to meet your manufacturing schedule.


About Laser Cutting
The microelectronics and RF/Microwave industry have been using laser cut epoxy pre-forms for years. The laser cut system has many advantages:
  • No expensive NRE tooling cost. There is a set-up program fee, but it is typically much less expensive than a die cost.
  • Speed and flexibility. There is no long lead time for a die cut tool. If there are changes needed, the CAD data is easily adjusted to accommodate required modifications.
  • Economical for both short and long runs.
  • Multi-up pre-forms of different shapes and sizes on individual sheets.


Also available:
  • Laser cut silicon and silicon fiber reinforced press board for board mount fixturing.


Value Added Services:
  • We recommend IKE Micro for board mount assembly services. IKE has installed thousands of substrates and boards (duroid, thick film, thin film, FR4) onto carriers and housings for the defense and commercial electronics industries. IKE also offers feedthru installation on microwave housings, open package leak testing, and complete SMT, die attach, and wire bonding services. Check out www.ikemicro.com for more details.


"M/A-COM orders 5025E pre-forms for a large quantity military job through Bonding Source. Our experience is limited when it comes to laser cut pre-forms, but Bonding Source provided us with samples and mounted a first article batch which showed the same results as traditional die cutting. Bonding Source is competitive on overall price with no minimum charges or concerns about expiration dates. IKE Micro, their sister company, also provides board-mount, chip installation and wire bonding for the same program. This effort allows them to manage the logistics for M/A-COM through a continued partnership."


-- Rick Zylak
Manufacturing Manager
M/A-COM, Tyco Electronics